Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027145/0373 | |
| Pages: | 4 |
| | Recorded: | 10/31/2011 | | |
| Attorney Dkt #: | KASHIMA/CASIO/TERAMIKROS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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05/27/2008
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Application #:
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11043886
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Filing Dt:
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01/26/2005
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Publication #:
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Pub Dt:
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07/28/2005
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Title:
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OPTICAL SENSOR MODULE WITH SEMICONDUCTOR DEVICE FOR DRIVE
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12358572
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Filing Dt:
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01/23/2009
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Publication #:
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Pub Dt:
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08/06/2009
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Title:
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SEMICONDUCTOR DEVICE INCLUDING WIRING AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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12506503
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Filing Dt:
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07/21/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Title:
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METHOD OF FORMING WIRING ON A PLURALITY OF SEMICONDUCTOR DEVICES FROM A SINGLE METAL PLATE, AND A SEMICONDUCTOR CONSTRUCTION ASSEMBLY FORMED BY THE METHOD
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12507188
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Filing Dt:
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07/22/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Title:
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SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING IN A WAFER STATE AND MANUFACTURING METHOD THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12555997
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Filing Dt:
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09/09/2009
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Publication #:
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Pub Dt:
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03/11/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAME
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Assignee
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| 10-6, IMAI 3-CHOME, OME-SHI, |
| TOKYO,, JAPAN 198-8555 |
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Correspondence name and address
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LEONARD HOLTZ
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220 FIFTH AVENUE
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16TH FLOOR
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NEW YORK, NY 10001
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