Patent Assignment Details
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| Reel/Frame: | 027170/0017 | |
| Pages: | 4 |
| | Recorded: | 11/03/2011 | | |
| Attorney Dkt #: | MIY.001.0360.NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11200884
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Filing Dt:
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08/09/2005
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Publication #:
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Pub Dt:
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12/08/2005
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Title:
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Ball grid array solder joint reliability
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Assignee
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| 5-5, KEIHAN-HONDORI 2-CHROME |
| MORIGUCHI-SHI, OSAKA, JAPAN 570-8677 |
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Correspondence name and address
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NOVAK DRUCE & QUIGG LLP
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300 NEW JERSEY AVENUE
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FIFTH FLOOR
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WASHINGTON, DC 20001
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