Patent Assignment Details
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| Reel/Frame: | 027197/0377 | |
| Pages: | 2 |
| | Recorded: | 11/09/2011 | | |
| Attorney Dkt #: | HARAP0225US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12237816
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Filing Dt:
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09/25/2008
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Publication #:
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Pub Dt:
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04/02/2009
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Title:
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MULTILAYER BODY FOR ELECTROPHORESIS AND TRANSFER, CHIP FOR ELECTROPHORESIS AND TRANSFER, ELECTROPHORESIS AND TRANSFER APPARATUS, METHOD OF ELECTROPHORESIS AND TRANSFER, AND METHOD OF MANUFACTURING MULTILAYER BODY FOR ELECTROPHORESIS AND TRANSFER
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Assignee
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| 1-5-1, TAITO |
| TAITO-KU |
| TOKYO, JAPAN 110-8560 |
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Correspondence name and address
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HEIDI A. BOEHLEFELD
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1621 EUCLID AVENUE
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NINETEENTH FLOOR
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CLEVELAND, OH 44115
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