Patent Assignment Details
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Reel/Frame: | 027266/0616 | |
| Pages: | 6 |
| | Recorded: | 11/22/2011 | | |
Attorney Dkt #: | APOM069 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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13302219
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Filing Dt:
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11/22/2011
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Publication #:
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Pub Dt:
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05/23/2013
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Title:
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METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRESSION IN WAFER LEVEL PACKAGING PROCESS
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Assignee
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475 OAKMEAD PKWY |
SUNNYVALE, CALIFORNIA 94085 |
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Correspondence name and address
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CHEIN-HWA S. TSAO
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6684 MT PAKRON DRIVE
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SAN JOSE, CA 95120
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