Patent Assignment Details
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| Reel/Frame: | 027307/0865 | |
| Pages: | 3 |
| | Recorded: | 12/01/2011 | | |
| Attorney Dkt #: | 4593-350 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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13238026
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Filing Dt:
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09/21/2011
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Publication #:
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Pub Dt:
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03/21/2013
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Title:
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SUSPENSION HAVING BONDING PADS WITH SOLDER LAYERS, MANUFACTURING METHOD OF A SUSPENSION, AND CONNECTING METHOD BETWEEN A SUSPENSION AND A SLIDER
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Assignee
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, CHINA |
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Correspondence name and address
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NIXON & VANDERHYE, PC
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901 NORTH GLEBE ROAD, 11TH FLOOR
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ARLINGTON, VA 22203
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