Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027328/0488 | |
| Pages: | 2 |
| | Recorded: | 12/01/2011 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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12077175
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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WIRING STRUCTURE OF A SUBSTRATE
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12077179
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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BSC MACROSTRUCTURE FOR THREE-DIMENSIONAL WIRING AND SUBSTRATE HAVING THE BSC MACROSTRUCTURE
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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13135434
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Filing Dt:
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07/05/2011
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Publication #:
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Pub Dt:
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10/27/2011
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Title:
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SEMICONDUCTOR DEVICE AND BYPASS CAPACITOR MODULE
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Assignee
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| 2-3-4, SHINYOKOHAMA, KOHOKU-KU |
| YOKOHAMA-CITY, KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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COLLARD & ROE, P.C.
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1077 NORTHERN BOULEVARD
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ROSLYN, NY 11576
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