Patent Assignment Details
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| Reel/Frame: | 027335/0106 | |
| Pages: | 3 |
| | Recorded: | 12/07/2011 | | |
| Attorney Dkt #: | 851663.542 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13313397
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Filing Dt:
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12/07/2011
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Publication #:
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Pub Dt:
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06/13/2013
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Title:
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OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
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Assignee
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| 28 ANG MO KIO, INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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DAVID V. CARLSON
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701 FIFTH AVE
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SUITE 5400
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SEATTLE, WA 98104
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