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Reel/Frame:027343/0807   Pages: 7
Recorded: 12/06/2011
Attorney Dkt #:8354-100741-US (PO1021A)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/29/2014
Application #:
13278351
Filing Dt:
10/21/2011
Publication #:
Pub Dt:
06/28/2012
Title:
PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
Assignors
1
Exec Dt:
10/25/2011
2
Exec Dt:
10/28/2011
3
Exec Dt:
12/06/2011
4
Exec Dt:
10/25/2011
Assignee
1
1151 MAPLEWOOD DRIVE
ITASCA, ILLINOIS 60143
Correspondence name and address
TIMOTHY R. BAUMANN
120 SOUTH LA SALLE STREET, SUITE 1600
CHICAGO, IL 60603

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