Patent Assignment Details
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| Reel/Frame: | 027348/0175 | |
| Pages: | 6 |
| | Recorded: | 12/08/2011 | | |
| Attorney Dkt #: | 2515.0378 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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13315010
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Filing Dt:
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12/08/2011
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Publication #:
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Pub Dt:
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06/13/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THICK ENCAPSULANT FOR STIFFNESS WITH RECESSES FOR STRESS RELIEF IN FO-WLCSP
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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