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Reel/Frame:027474/0443   Pages: 4
Recorded: 01/04/2012
Attorney Dkt #:XA-11823/T3767-18223US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/07/2015
Application #:
13274288
Filing Dt:
10/14/2011
Publication #:
Pub Dt:
04/19/2012
Title:
WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAPE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
10/24/2011
2
Exec Dt:
10/27/2011
3
Exec Dt:
10/28/2011
4
Exec Dt:
10/24/2011
5
Exec Dt:
10/24/2011
6
Exec Dt:
10/24/2011
7
Exec Dt:
10/24/2011
Assignee
1
1-1, NISHI-SHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO, JAPAN 163-0449
Correspondence name and address
MITCHELL W. SHAPIRO
1751 PINNACLE DRIVE, SUITE 500
MCLEAN, VA 22102-3833

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