Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027499/0058 | |
| Pages: | 6 |
| | Recorded: | 01/09/2012 | | |
| Attorney Dkt #: | 27-798P & 27-798 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/01/2015
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Application #:
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13298267
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Filing Dt:
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11/16/2011
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Publication #:
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Pub Dt:
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05/17/2012
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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