Patent Assignment Details
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| Reel/Frame: | 027524/0455 | |
| Pages: | 3 |
| | Recorded: | 01/12/2012 | | |
| Attorney Dkt #: | OGOSH202USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13375263
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Filing Dt:
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01/11/2012
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Publication #:
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Pub Dt:
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05/03/2012
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Title:
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Copper Foil for Semiconductor Package Substrate and Substrate for Semiconductor Package
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Assignee
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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WILLIAM BAK, HOWSON & HOWSON LLP
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501 OFFICE CENTER DRIVE
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SUITE 210
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FORT WASHINGTON, PA 19034
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