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Reel/Frame:027534/0972   Pages: 12
Recorded: 01/13/2012
Attorney Dkt #:2515.0323
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/04/2013
Application #:
13333739
Filing Dt:
12/21/2011
Publication #:
Pub Dt:
05/09/2013
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF
Assignors
1
Exec Dt:
01/12/2012
2
Exec Dt:
01/12/2012
3
Exec Dt:
01/12/2012
4
Exec Dt:
01/12/2012
5
Exec Dt:
01/13/2012
6
Exec Dt:
01/12/2012
7
Exec Dt:
01/12/2012
8
Exec Dt:
01/12/2012
9
Exec Dt:
01/05/2012
10
Exec Dt:
01/06/2012
Assignee
1
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondence name and address
PATENT LAW GROUP
605 W. KNOX ROAD
SUITE 104
TEMPE, AZ 85284

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