Patent Assignment Details
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| Reel/Frame: | 027545/0552 | |
| Pages: | 3 |
| | Recorded: | 01/12/2012 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/26/2013
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Application #:
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13343941
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Filing Dt:
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01/05/2012
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Title:
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BONDING A SOLDER BUMP TO A LEAD USING COMPRESSION AND RETRACTION FORCES
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Assignee
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| 12500 TI BOULEVARD |
| MS 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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MS 3999
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P.O. BOX 655474
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DALLAS, TEXAS 75265
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