Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 027559/0066 | |
| Pages: | 5 |
| | Recorded: | 01/19/2012 | | |
Attorney Dkt #: | 086039-0096 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
13384819
|
Filing Dt:
|
01/19/2012
|
Publication #:
|
|
Pub Dt:
|
11/21/2013
| | | | |
Title:
|
BONDING WIRE FOR SEMICONDUCTOR
|
|
Assignees
|
|
|
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
TOKYO, JAPAN 1010021 |
|
|
|
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, |
SAITAMA, JAPAN 3580032 |
|
Correspondence name and address
|
|
LOUIS J. DELJUIDICE
|
|
MCDERMOTT WILL & EMERY LLP
|
|
600 13TH STREET, N.W.
|
|
WASHINGTON, DC 20005-3096
|
Search Results as of:
04/29/2024 02:09 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|