Patent Assignment Details
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| Reel/Frame: | 027649/0686 | |
| Pages: | 2 |
| | Recorded: | 02/03/2012 | | |
| Attorney Dkt #: | 111672 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13364592
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Filing Dt:
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02/02/2012
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Publication #:
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Pub Dt:
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08/16/2012
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Title:
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ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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WESTERMN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVE, NW
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SUITE 700
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WASHINGTON, DC 20036
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