Patent Assignment Details
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| Reel/Frame: | 027688/0027 | |
| Pages: | 2 |
| | Recorded: | 02/10/2012 | | |
| Attorney Dkt #: | T5057-R581 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2017
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Application #:
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13371120
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Filing Dt:
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02/10/2012
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Publication #:
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Pub Dt:
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08/15/2013
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Title:
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METHODS OF IMPROVING BUMP ALLOCATION FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES WITH IMPROVED BUMP ALLOCATION
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Assignee
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
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1700 DIAGONAL ROAD, SUITE 300
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ALEXANDRIA, VA 22314
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