Patent Assignment Details
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Reel/Frame: | 027773/0814 | |
| Pages: | 3 |
| | Recorded: | 02/28/2012 | | |
Attorney Dkt #: | 56436.3300 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13406791
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Filing Dt:
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02/28/2012
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Publication #:
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Pub Dt:
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08/29/2013
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Title:
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Method for Forming Dielectric Film Containing Si-C bonds by Atomic Layer Deposition Using Precursor Containing Si-C-Si bond
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Assignee
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VERSTERKERSTRAAT 8 |
1322 AP |
ALMERE, NETHERLANDS |
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Correspondence name and address
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SNELL & WILMER L.L.P. / DAMON L. BOYD
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ONE ARIZONA CENTER
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400 EAST VAN BUREN STREET
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PHOENIX, AZ 85004-2202
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