Patent Assignment Details
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| Reel/Frame: | 027874/0526 | |
| Pages: | 2 |
| | Recorded: | 03/16/2012 | | |
| Attorney Dkt #: | 09734/LH |
| Conveyance: | CHANGE OF OWNERSHIP BY CORPORATE SEPARATION |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12632033
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Filing Dt:
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12/07/2009
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Publication #:
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Pub Dt:
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06/10/2010
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM
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Assignee
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| 10-6, IMAI 3-CHOME, OME-SHI, |
| TOKYO,, JAPAN 198-8555 |
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Correspondence name and address
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LEONARD HOLTZ
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220 FIFTH AVENUE
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16TH FLOOR
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NEW YORK, NY 10001
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