Patent Assignment Details
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| Reel/Frame: | 027914/0072 | |
| Pages: | 17 |
| | Recorded: | 03/23/2012 | | |
| Attorney Dkt #: | FIS920120005US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13427940
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Filing Dt:
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03/23/2012
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Publication #:
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Pub Dt:
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09/26/2013
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Title:
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ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORP - FISHKILL DRAFTING CENTER
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2070 ROUTE 52
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BLDG 321 M/D 482
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HOPEWELL JUNCTION, NY 12533
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