Patent Assignment Details
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| Reel/Frame: | 027931/0442 | |
| Pages: | 3 |
| | Recorded: | 03/26/2012 | | |
| Conveyance: | CONFIRMATORY ASSIGNMENT |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/1996
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Application #:
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08106146
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Filing Dt:
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08/13/1993
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Title:
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PACKAGE STRUCTURE HAVING ACCESSIBLE CHIP
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Assignee
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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Correspondence name and address
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DAVID L. SCHAEFFER
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411 EAST PLUMERIA DRIVE, MS 41
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NXP SEMICONDUCTORS, IP&L
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SAN JOSE, CA 95134
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