Patent Assignment Details
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| Reel/Frame: | 027935/0420 | |
| Pages: | 6 |
| | Recorded: | 03/27/2012 | | |
| Attorney Dkt #: | 6120-0111PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13394993
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Filing Dt:
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03/27/2012
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Publication #:
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Pub Dt:
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07/26/2012
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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