Patent Assignment Details
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Reel/Frame: | 027969/0001 | |
| Pages: | 3 |
| | Recorded: | 03/22/2012 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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13416389
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Filing Dt:
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03/09/2012
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Publication #:
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Pub Dt:
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09/13/2012
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Title:
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LIQUID RESIN MATERIAL MOLDING SYSTEM
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Assignee
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2110, OAZA MINAMIJO, SAKAKI-MACHI |
HANISHINA-GUN |
NAGANO, JAPAN 389-0693 |
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Correspondence name and address
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BRUCE L. ADAMS, ESQ.
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ADAMS & WILKS
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17 BATTERY PLACE-SUITE-SUITE 1231
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NEW YORK, NEW YORK 10004
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