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Patent Assignment Details
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Reel/Frame:027969/0001   Pages: 3
Recorded: 03/22/2012
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/09/2014
Application #:
13416389
Filing Dt:
03/09/2012
Publication #:
Pub Dt:
09/13/2012
Title:
LIQUID RESIN MATERIAL MOLDING SYSTEM
Assignor
1
Exec Dt:
03/06/2012
Assignee
1
2110, OAZA MINAMIJO, SAKAKI-MACHI
HANISHINA-GUN
NAGANO, JAPAN 389-0693
Correspondence name and address
BRUCE L. ADAMS, ESQ.
ADAMS & WILKS
17 BATTERY PLACE-SUITE-SUITE 1231
NEW YORK, NEW YORK 10004

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