Patent Assignment Details
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| Reel/Frame: | 027994/0679 | |
| Pages: | 5 |
| | Recorded: | 04/05/2012 | | |
| Attorney Dkt #: | 0076885-000006 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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13387125
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Filing Dt:
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04/05/2012
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Publication #:
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Pub Dt:
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07/19/2012
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Title:
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METHOD FOR HEAT TREATING A SILICON WAFER
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Assignee
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| 6-3, OHSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN |
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Correspondence name and address
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BUCHANAN INGERSOLL & ROONEY P.C.
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P.O. BOX 1404
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ALEXANDRIA, VA 22313-1404
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