Patent Assignment Details
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| Reel/Frame: | 028043/0107 | |
| Pages: | 2 |
| | Recorded: | 04/13/2012 | | |
| Attorney Dkt #: | 1684.0023 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13181274
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Filing Dt:
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07/12/2011
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Publication #:
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Pub Dt:
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01/17/2013
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Title:
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Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die
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Assignee
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| P.O. BOX 24619 |
| TEMPE, ARIZONA 85285 |
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Correspondence name and address
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PATENT LAW GROUP
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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