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Patent Assignment Details
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Reel/Frame:028049/0436   Pages: 4
Recorded: 04/16/2012
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/20/1998
Application #:
08737087
Filing Dt:
02/07/1997
Title:
MOLD FOR MOLDING OR INJECTION-MOLDING POLYMER COMPOUNDS, AND MOLD ACCESSORIES, IN PARTICULAR EJECTOR DEVICE OR CORE PIN DEVICE FOR A MOLD OF THIS KIND
Assignor
1
Exec Dt:
08/21/2009
Assignee
1
29111 STEPHENSON HIGHWAY
MADISON HEIGHTS, MICHIGAN 48071
Correspondence name and address
JEAN MOYER
3010 DISNEY STREET
CINCINNATI, OH 45209

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