Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028049/0634 | |
| Pages: | 10 |
| | Recorded: | 04/16/2012 | | |
| Attorney Dkt #: | 6657-48600 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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04/06/1993
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Application #:
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07767171
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Filing Dt:
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09/27/1991
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Title:
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EXPOSED DIE-ATTACH HEATSINK PACKAGE
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Patent #:
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Issue Dt:
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04/27/1993
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Application #:
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07811406
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Filing Dt:
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12/20/1991
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH DEVICE AND WIRE COAT ASSEMBLY
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Patent #:
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Issue Dt:
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10/11/1994
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Application #:
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07847517
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Filing Dt:
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03/06/1992
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Title:
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SYSTEM FOR CONTROLLING AN INTEGRATED PRODUCT PROCESS FOR SEMICONDUCTOR WAFERS AND PACKAGES
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Patent #:
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Issue Dt:
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11/18/1997
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Application #:
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08587830
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Filing Dt:
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01/11/1996
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Title:
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METHOD OF ASSEMBLING AND COOLING A PACKAGE STRUCTURE WITH ACCESSIBLE CHIP
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12171577
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Filing Dt:
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07/11/2008
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING
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Assignee
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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Correspondence name and address
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DAWN DELUCA
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1120 SOUTH CAPITAL OF TEXAS HIGHWAY
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BUILDING 2, SUITE 300
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AUSTIN, TX 78746
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