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Reel/Frame:028049/0649   Pages: 12
Recorded: 04/16/2012
Attorney Dkt #:6657-48600
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 32
1
Patent #:
5268059
Issue Dt:
12/07/1993
Application #:
07939215
Filing Dt:
09/02/1992
Title:
DETAPING MACHINE FOR REMOVAL OF INTEGRATED CIRCUIT DEVICES FROM SEALED POCKET TAPE
2
Patent #:
5491362
Issue Dt:
02/13/1996
Application #:
08106146
Filing Dt:
08/13/1993
Title:
PACKAGE STRUCTURE HAVING ACCESSIBLE CHIP
3
Patent #:
5537031
Issue Dt:
07/16/1996
Application #:
08486405
Filing Dt:
06/05/1995
Title:
INTEGRATED CIRCUIT TEST JIG
4
Patent #:
5570033
Issue Dt:
10/29/1996
Application #:
08504944
Filing Dt:
07/20/1995
Title:
SPRING PROBE BGA (BALL GRID ARRAY) CONTACTOR WITH DEVICE STOP AND METHOD THEREFOR
5
Patent #:
5563509
Issue Dt:
10/08/1996
Application #:
08574862
Filing Dt:
12/19/1995
Title:
ADAPTABLE LOAD BOARD ASSEMBLY FOR TESTING ICS WITH DIFFERENT POWER/GROUND BOND PAD AND/OR PIN
6
Patent #:
5700045
Issue Dt:
12/23/1997
Application #:
08677150
Filing Dt:
07/09/1996
Title:
UNIVERSAL QFP TRAY TRANSFER METHOD
7
Patent #:
6353261
Issue Dt:
03/05/2002
Application #:
09303891
Filing Dt:
05/03/1999
Title:
METHOD AND APPARATUS FOR REDUCING INTERCONNECT RESISTANCE USING AN INTERCONNECT WELL
8
Patent #:
6798061
Issue Dt:
09/28/2004
Application #:
09440595
Filing Dt:
11/15/1999
Publication #:
US20020079566
Pub Dt:
06/27/2002
Title:
MULTIPLE SEMICONDUCTOR CHIP (MULTI-CHIP) MODULE FOR USE IN HIGH-POWER APPLICATIONS
9
Patent #:
6552422
Issue Dt:
04/22/2003
Application #:
09649673
Filing Dt:
08/28/2000
Title:
DATA CARRIER WITH AN INTEGRATED ELECTRONIC COMPONENT AND WITH A TRANSMISSION COLL WHICH COMPRISES TURN PORTIONS ARRANGED DIRECTLY AGAINST SAID COMPONENT
10
Patent #:
6879015
Issue Dt:
04/12/2005
Application #:
09829797
Filing Dt:
04/10/2001
Publication #:
US20010045669
Pub Dt:
11/29/2001
Title:
SEMICONDUCTOR DEVICE WITH ISOLATED INTERMETAL DIELECTRICS
11
Patent #:
6649978
Issue Dt:
11/18/2003
Application #:
09884223
Filing Dt:
06/19/2001
Publication #:
US20020190317
Pub Dt:
12/19/2002
Title:
SEMICONDUCTOR MODULE HAVING MULTIPLE SEMICONDUCTOR CHIPS
12
Patent #:
6680545
Issue Dt:
01/20/2004
Application #:
09915677
Filing Dt:
07/26/2001
Publication #:
US20020036355
Pub Dt:
03/28/2002
Title:
SEMICONDUCTOR DEVICES
13
Patent #:
6643142
Issue Dt:
11/04/2003
Application #:
09973317
Filing Dt:
10/09/2001
Publication #:
US20020075663
Pub Dt:
06/20/2002
Title:
MODULE HAVING A LEAD FRAME EQUIPPED WITH COMPONENTS ON BOTH SIDES
14
Patent #:
6777963
Issue Dt:
08/17/2004
Application #:
10005689
Filing Dt:
11/08/2001
Publication #:
US20030085722
Pub Dt:
05/08/2003
Title:
CHIP-MOUNTED CONTACT SPRINGS
15
Patent #:
6617697
Issue Dt:
09/09/2003
Application #:
10015720
Filing Dt:
11/30/2001
Publication #:
US20020084517
Pub Dt:
07/04/2002
Title:
ASSEMBLY WITH CONNECTING STRUCTURE
16
Patent #:
6853944
Issue Dt:
02/08/2005
Application #:
10282450
Filing Dt:
10/29/2002
Publication #:
US20040083075
Pub Dt:
04/29/2004
Title:
JUNCTION TEMPERATURES MEASUREMENTS IN SEMICONDUCTOR CHIP PACKAGE TECHNOLOGY
17
Patent #:
6919643
Issue Dt:
07/19/2005
Application #:
10301200
Filing Dt:
11/21/2002
Publication #:
US20030098468
Pub Dt:
05/29/2003
Title:
MULTI-CHIP MODULE SEMICONDUCTOR DEVICES
18
Patent #:
7029948
Issue Dt:
04/18/2006
Application #:
10492120
Filing Dt:
10/11/2004
Publication #:
US20050064628
Pub Dt:
03/24/2005
Title:
ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
19
Patent #:
7340872
Issue Dt:
03/11/2008
Application #:
10497644
Filing Dt:
06/04/2004
Publication #:
US20050035025
Pub Dt:
02/17/2005
Title:
METHOD OF AND DEVICE FOR PACKAGING ELECTRONIC COMPONENTS THUS PACKAGED
20
Patent #:
7018248
Issue Dt:
03/28/2006
Application #:
10504752
Filing Dt:
08/17/2004
Publication #:
US20050118893
Pub Dt:
06/02/2005
Title:
DEVICE FOR FORMING CONNECTION ELEMENTS
21
Patent #:
7413108
Issue Dt:
08/19/2008
Application #:
10525594
Filing Dt:
02/25/2005
Publication #:
US20050258215
Pub Dt:
11/24/2005
Title:
WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING TOOL
22
Patent #:
7196409
Issue Dt:
03/27/2007
Application #:
10548297
Filing Dt:
09/06/2005
Publication #:
US20060202327
Pub Dt:
09/14/2006
Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR BODY AND METHOD OF MANUFACTURING THEREOF
23
Patent #:
7253532
Issue Dt:
08/07/2007
Application #:
11351746
Filing Dt:
02/10/2006
Publication #:
US20060128062
Pub Dt:
06/15/2006
Title:
ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
24
Patent #:
7733657
Issue Dt:
06/08/2010
Application #:
11572871
Filing Dt:
01/29/2007
Publication #:
US20090190314
Pub Dt:
07/30/2009
Title:
MODULE BASE UNIT WITH STRAIN RELIEF MEANS
25
Patent #:
7545026
Issue Dt:
06/09/2009
Application #:
11632518
Filing Dt:
11/05/2007
Publication #:
US20080191361
Pub Dt:
08/14/2008
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT
26
Patent #:
7750436
Issue Dt:
07/06/2010
Application #:
11632887
Filing Dt:
05/15/2008
Publication #:
US20090014831
Pub Dt:
01/15/2009
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
27
Patent #:
7804165
Issue Dt:
09/28/2010
Application #:
11913585
Filing Dt:
10/24/2008
Publication #:
US20090166771
Pub Dt:
07/02/2009
Title:
DEVICE COMPRISING A SENSOR MODULE
28
Patent #:
7823369
Issue Dt:
11/02/2010
Application #:
12018089
Filing Dt:
01/22/2008
Publication #:
US20080127610
Pub Dt:
06/05/2008
Title:
DEVICE FOR PACKAGING AN ELECTRONIC COMPONENT
29
Patent #:
7825526
Issue Dt:
11/02/2010
Application #:
12088713
Filing Dt:
06/24/2008
Publication #:
US20100006992
Pub Dt:
01/14/2010
Title:
FINE-PITCH ROUTING IN A LEAD FRAME BASED SYSTEM-IN-PACKAGE (SIP) DEVICE
30
Patent #:
7709954
Issue Dt:
05/04/2010
Application #:
12090686
Filing Dt:
11/18/2008
Publication #:
US20090072397
Pub Dt:
03/19/2009
Title:
REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD THEREFOR
31
Patent #:
7884289
Issue Dt:
02/08/2011
Application #:
12297022
Filing Dt:
10/14/2008
Publication #:
US20090159331
Pub Dt:
06/25/2009
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
32
Patent #:
8097521
Issue Dt:
01/17/2012
Application #:
12815954
Filing Dt:
06/15/2010
Publication #:
US20100251542
Pub Dt:
10/07/2010
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
Assignor
1
NXP B.V.
Exec Dt:
03/27/2012
Assignee
1
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
2711 CENTERVILLE RD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondence name and address
DAWN DELUCA
1120 SOUTH CAPITAL OF TEXAS HIGHWAY
BUILDING 2, SUITE 300
AUSTIN, TX 78746

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