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Reel/Frame:028087/0901   Pages: 13
Recorded: 04/23/2012
Attorney Dkt #:DOCKET@GBCLAW.NET
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE TITLE OF THE INVENTION PREVIOUSLY RECORDED ON REEL 027884 FRAME 0655. ASSIGNOR(S) HEREBY CONFIRMS THE THE TITLE OF THE INVENTION IS SEMICONDUCTOR DEVICE CHIP MOUNTING METHOD.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13423454
Filing Dt:
03/19/2012
Publication #:
Pub Dt:
09/27/2012
Title:
SEMICONDUCTOR DEVICE CHIP MOUNTING METHOD
Assignor
1
Exec Dt:
02/08/2012
Assignee
1
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 143-8580
Correspondence name and address
GREER, BURNS & CRAIN, LTD.
300 SOUTH WACKER DRIVE
SUITE 2500
CHICAGO, IL 60606-6771

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