Patent Assignment Details
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Reel/Frame: | 028142/0283 | |
| Pages: | 3 |
| | Recorded: | 05/02/2012 | | |
Attorney Dkt #: | EI-2-09-003 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12836612
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Filing Dt:
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08/13/2010
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Publication #:
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Pub Dt:
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02/16/2012
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Title:
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SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME
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Assignee
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1093 CLARK STREET |
ENDICOTT, NEW YORK 13760 |
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Correspondence name and address
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MARK LEVY, HINMAN, HOWARD & KATTELL, LLP
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80 EXCHANGE STREET
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P.O. BOX 5250
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BINGHAMTON, NY 13901
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