Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 028168/0276 | |
| Pages: | 4 |
| | Recorded: | 05/07/2012 | | |
| Attorney Dkt #: | YGUC.3931 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2015
|
Application #:
|
13501746
|
Filing Dt:
|
04/12/2012
|
|
Publication #:
|
|
Pub Dt:
|
04/04/2013
| | | | |
|
Title:
|
SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
|
|
|
Assignee
|
|
|
|
|
| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
|
|
Correspondence name and address
|
| |
CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
|
| |
601 SW 2ND AVE., STE. 1600
|
| |
PORTLAND, OR 97204
|
Search Results as of:
04/27/2024 04:28 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
