Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 028221/0237 | |
| Pages: | 3 |
| | Recorded: | 05/16/2012 | | |
| Attorney Dkt #: | AOS007 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2007
|
Application #:
|
11149954
|
Filing Dt:
|
06/09/2005
|
|
Publication #:
|
|
Pub Dt:
|
12/14/2006
| | | | |
|
Title:
|
WAFER LEVEL BUMPLESS METHOD OF MAKING A FLIP CHIP MOUNTED SEMICONDUCTOR DEVICE PACKAGE
|
|
|
Assignee
|
|
|
|
|
| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, HM12, BERMUDA |
|
|
Correspondence name and address
|
| |
JANE ZHANG
|
| |
111 N. MARKET STREET
|
| |
SUITE 1020
|
| |
SAN JOSE, CA 95113
|
Search Results as of:
05/13/2024 10:46 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
