Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 028395/0983 | |
| Pages: | 2 |
| | Recorded: | 06/18/2012 | | |
Attorney Dkt #: | 11274.0012 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13431764
|
Filing Dt:
|
03/27/2012
|
Publication #:
|
|
Pub Dt:
|
10/04/2012
| | | | |
Title:
|
PRESSURING MODULE, PRESSURING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE BONDING METHOD, AND BONDED SUBSTRATE
|
|
Assignee
|
|
|
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-8331 |
|
Correspondence name and address
|
|
FINNEGAN
|
|
901 NEW YORK AVENUE NW
|
|
WASHINGTON, DC, DC 20001
|
Search Results as of:
05/11/2024 08:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|