Patent Assignment Details
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| Reel/Frame: | 028446/0352 | |
| Pages: | 2 |
| | Recorded: | 06/26/2012 | | |
| Attorney Dkt #: | YGUC.3933 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2019
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Application #:
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13519217
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Filing Dt:
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06/26/2012
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Publication #:
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Pub Dt:
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11/22/2012
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Title:
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METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMPONENT
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Assignee
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
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601 SW 2ND AVE., STE. 1600
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PORTLAND, OR 97204
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