Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028498/0266 | |
| Pages: | 4 |
| | Recorded: | 07/06/2012 | | |
| Attorney Dkt #: | 18817-191 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13542782
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Filing Dt:
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07/06/2012
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Publication #:
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Pub Dt:
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12/12/2013
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Title:
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Pre-molded Cavity 3D Packaging Module with Layout
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Assignees
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| 2F, NO. 42, PARK AVENUE 2, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| NO.8, ALLEY 48, LANE 240, KUOSHENG ST., CHUPEI CITY |
| HSINCHU COUNTY, TAIWAN |
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Correspondence name and address
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
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8230 BOONE BLVD. SUITE 405
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VIENNA, VA 22182
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