Patent Assignment Details
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| Reel/Frame: | 028747/0924 | |
| Pages: | 48 |
| | Recorded: | 08/08/2012 | | |
| Attorney Dkt #: | CU-6366 RJS/DS |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12048695
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Filing Dt:
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03/14/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
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Assignee
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| 2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
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CHICAGO, IL 60604
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