Patent Assignment Details
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| Reel/Frame: | 028853/0562 | |
| Pages: | 3 |
| | Recorded: | 08/27/2012 | | |
| Attorney Dkt #: | 32433U |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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13594217
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Filing Dt:
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08/24/2012
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Publication #:
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Pub Dt:
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02/28/2013
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Title:
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TRENCH FILLING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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Assignee
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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Correspondence name and address
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NATH, GOLDBERG & MEYER
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112 S. WEST STREET
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ALEXANDRIA, VA 22314
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