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Reel/Frame:028867/0216   Pages: 27
Recorded: 08/29/2012
Attorney Dkt #:3521.52
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 40
1
Patent #:
6224690
Issue Dt:
05/01/2001
Application #:
08614984
Filing Dt:
03/12/1996
Title:
FLIP-CHIP INTERCONNECTIONS USING LEAD-FREE SOLDERS
2
Patent #:
6251528
Issue Dt:
06/26/2001
Application #:
09004808
Filing Dt:
01/09/1998
Title:
METHOD TO PLATE C4 TO COPPER STUD
3
Patent #:
6235996
Issue Dt:
05/22/2001
Application #:
09014804
Filing Dt:
01/28/1998
Title:
INTERCONNECTION STRUCTURE AND PROCESS FOR MODULE ASSEMBLY AND REWORK
4
Patent #:
6197222
Issue Dt:
03/06/2001
Application #:
09119569
Filing Dt:
07/20/1998
Title:
LEAD FREE CONDUCTIVE COMPOSITES FOR ELECTRICAL INTERCONNECTIONS
5
Patent #:
6225206
Issue Dt:
05/01/2001
Application #:
09309405
Filing Dt:
05/10/1999
Title:
FLIP CHIP C4 EXTENSION STRUCTURE AND PROCESS
6
Patent #:
6258703
Issue Dt:
07/10/2001
Application #:
09359061
Filing Dt:
07/21/1999
Title:
REFLOW OF LOW MELT SOLDER TIP C4'S
7
Patent #:
6893799
Issue Dt:
05/17/2005
Application #:
10248976
Filing Dt:
03/06/2003
Publication #:
US20040175657
Pub Dt:
09/09/2004
Title:
DUAL-SOLDER FLIP-CHIP SOLDER BUMP
8
Patent #:
6917113
Issue Dt:
07/12/2005
Application #:
10249621
Filing Dt:
04/24/2003
Publication #:
US20040212094
Pub Dt:
10/28/2004
Title:
LEAD-FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS AND PASSIVE COMPONENT ASSEMBLY
9
Patent #:
7635643
Issue Dt:
12/22/2009
Application #:
11380215
Filing Dt:
04/26/2006
Publication #:
US20070252274
Pub Dt:
11/01/2007
Title:
METHOD FOR FORMING C4 CONNECTIONS ON INTEGRATED CIRCUIT CHIPS AND THE RESULTING DEVICES
10
Patent #:
7923836
Issue Dt:
04/12/2011
Application #:
11459119
Filing Dt:
07/21/2006
Publication #:
US20080017984
Pub Dt:
01/24/2008
Title:
BLM STRUCTURE FOR APPLICATION TO COPPER PAD
11
Patent #:
7615477
Issue Dt:
11/10/2009
Application #:
11566956
Filing Dt:
12/05/2006
Publication #:
US20070099342
Pub Dt:
05/03/2007
Title:
METHOD OF FABRICATING A BGA PACKAGE HAVING DECREASED ADHESION
12
Patent #:
7498198
Issue Dt:
03/03/2009
Application #:
11742120
Filing Dt:
04/30/2007
Publication #:
US20080265435
Pub Dt:
10/30/2008
Title:
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRONIC PACKAGES USING UNDERFILL MATERIALS WITH SPATIALLY VARYING PROPERTIES
13
Patent #:
7731077
Issue Dt:
06/08/2010
Application #:
11759298
Filing Dt:
06/07/2007
Publication #:
US20070228117
Pub Dt:
10/04/2007
Title:
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS IN LEAD-FREE BGAS ASSEMBLED WITH LEAD-BEARING SOLDERS
14
Patent #:
7816754
Issue Dt:
10/19/2010
Application #:
11762479
Filing Dt:
06/13/2007
Publication #:
US20070228566
Pub Dt:
10/04/2007
Title:
BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PADS
15
Patent #:
7833897
Issue Dt:
11/16/2010
Application #:
11778678
Filing Dt:
07/17/2007
Publication #:
US20090020590
Pub Dt:
01/22/2009
Title:
PROCESS FOR MAKING INTERCONNECT SOLDER PB-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE
16
Patent #:
7566649
Issue Dt:
07/28/2009
Application #:
11858147
Filing Dt:
09/20/2007
Publication #:
US20080009101
Pub Dt:
01/10/2008
Title:
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
17
Patent #:
7819376
Issue Dt:
10/26/2010
Application #:
11930269
Filing Dt:
10/31/2007
Publication #:
US20080175939
Pub Dt:
07/24/2008
Title:
TECHNIQUES FOR FORMING INTERCONNECTS
18
Patent #:
7868453
Issue Dt:
01/11/2011
Application #:
12032158
Filing Dt:
02/15/2008
Publication #:
US20090206479
Pub Dt:
08/20/2009
Title:
SOLDER INTERCONNECT PADS WITH CURRENT SPREADING LAYERS
19
Patent #:
7898063
Issue Dt:
03/01/2011
Application #:
12032642
Filing Dt:
02/16/2008
Publication #:
US20090206488
Pub Dt:
08/20/2009
Title:
THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER
20
Patent #:
8132775
Issue Dt:
03/13/2012
Application #:
12111372
Filing Dt:
04/29/2008
Publication #:
US20090266972
Pub Dt:
10/29/2009
Title:
SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES
21
Patent #:
8026613
Issue Dt:
09/27/2011
Application #:
12113108
Filing Dt:
04/30/2008
Publication #:
US20080203585
Pub Dt:
08/28/2008
Title:
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
22
Patent #:
7923849
Issue Dt:
04/12/2011
Application #:
12113152
Filing Dt:
04/30/2008
Publication #:
US20080206979
Pub Dt:
08/28/2008
Title:
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
23
Patent #:
7863180
Issue Dt:
01/04/2011
Application #:
12115564
Filing Dt:
05/06/2008
Publication #:
US20090278237
Pub Dt:
11/12/2009
Title:
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
24
Patent #:
7741226
Issue Dt:
06/22/2010
Application #:
12115568
Filing Dt:
05/06/2008
Publication #:
US20090280643
Pub Dt:
11/12/2009
Title:
OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME
25
Patent #:
7780063
Issue Dt:
08/24/2010
Application #:
12121236
Filing Dt:
05/15/2008
Publication #:
US20090283575
Pub Dt:
11/19/2009
Title:
TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS
26
Patent #:
7882623
Issue Dt:
02/08/2011
Application #:
12175541
Filing Dt:
07/18/2008
Publication #:
US20080271312
Pub Dt:
11/06/2008
Title:
APPARATUS FOR REMOVING INTERCONNECTS TO SEPARATE TWO PARTS OF A WORKPIECE
27
Patent #:
8138036
Issue Dt:
03/20/2012
Application #:
12188228
Filing Dt:
08/08/2008
Publication #:
US20100032764
Pub Dt:
02/11/2010
Title:
THROUGH SILICON VIA AND METHOD OF FABRICATING SAME
28
Patent #:
8097525
Issue Dt:
01/17/2012
Application #:
12201580
Filing Dt:
08/29/2008
Publication #:
US20100052108
Pub Dt:
03/04/2010
Title:
VERTICAL THROUGH-SILICON VIA FOR A SEMICONDUCTOR STRUCTURE
29
Patent #:
7839163
Issue Dt:
11/23/2010
Application #:
12357659
Filing Dt:
01/22/2009
Publication #:
US20100182040
Pub Dt:
07/22/2010
Title:
PROGRAMMABLE THROUGH SILICON VIA
30
Patent #:
8003512
Issue Dt:
08/23/2011
Application #:
12364684
Filing Dt:
02/03/2009
Publication #:
US20100193949
Pub Dt:
08/05/2010
Title:
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
31
Patent #:
8087566
Issue Dt:
01/03/2012
Application #:
12542797
Filing Dt:
08/18/2009
Publication #:
US20090302095
Pub Dt:
12/10/2009
Title:
TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS
32
Patent #:
7891538
Issue Dt:
02/22/2011
Application #:
12542800
Filing Dt:
08/18/2009
Publication #:
US20090302096
Pub Dt:
12/10/2009
Title:
TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS
33
Patent #:
7932169
Issue Dt:
04/26/2011
Application #:
12587301
Filing Dt:
10/05/2009
Publication #:
US20100062597
Pub Dt:
03/11/2010
Title:
INTERCONNECTION FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS
34
Patent #:
8128868
Issue Dt:
03/06/2012
Application #:
12605393
Filing Dt:
10/26/2009
Publication #:
US20100200988
Pub Dt:
08/12/2010
Title:
GRAIN REFINEMENT BY PRECIPITATE FORMATION IN PB-FREE ALLOYS OF TIN
35
Patent #:
8039356
Issue Dt:
10/18/2011
Application #:
12690299
Filing Dt:
01/20/2010
Publication #:
US20110177670
Pub Dt:
07/21/2011
Title:
THROUGH SILICON VIA LITHOGRAPHIC ALIGNMENT AND REGISTRATION
36
Patent #:
7875806
Issue Dt:
01/25/2011
Application #:
12706418
Filing Dt:
02/16/2010
Publication #:
US20100139958
Pub Dt:
06/10/2010
Title:
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS IN LEAD-FREE BGAS ASSEMBLED WITH LEAD-BEARING SOLDERS
37
Patent #:
8138020
Issue Dt:
03/20/2012
Application #:
12731793
Filing Dt:
03/25/2010
Publication #:
US20110233762
Pub Dt:
09/29/2011
Title:
WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD THEREOF
38
Patent #:
8153516
Issue Dt:
04/10/2012
Application #:
12857832
Filing Dt:
08/17/2010
Publication #:
US20100308460
Pub Dt:
12/09/2010
Title:
METHOD OF BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PADS
39
Patent #:
8138602
Issue Dt:
03/20/2012
Application #:
12885709
Filing Dt:
09/20/2010
Publication #:
US20110006421
Pub Dt:
01/13/2011
Title:
SOLDER INTERCONNECT PADS WITH CURRENT SPREADING LAYERS
40
Patent #:
7930664
Issue Dt:
04/19/2011
Application #:
12885727
Filing Dt:
09/20/2010
Publication #:
US20110034021
Pub Dt:
02/10/2011
Title:
PROGRAMMABLE THROUGH SILICON VIA
Assignor
1
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
07/18/2012
Assignee
1
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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