Patent Assignment Details
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| Reel/Frame: | 028953/0868 | |
| Pages: | 13 |
| | Recorded: | 09/13/2012 | | |
| Attorney Dkt #: | 10829-9070.US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2015
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Application #:
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13613540
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Filing Dt:
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09/13/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Title:
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STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AND ASSOCIATED SYSTEMS AND METHODS
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Assignee
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| 8000 S. FEDERAL WAY, P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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