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Total properties:
50
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Patent #:
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Issue Dt:
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02/05/2002
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Application #:
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08476475
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Filing Dt:
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06/07/1995
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Title:
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METHOD FOR FORMING REFLOWED SOLDER BALL WITH LOW MELTING POINT METAL CAP
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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08864044
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Filing Dt:
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05/28/1997
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Title:
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ENHANCED DESIGN AND PROCESS FOR A CONDUCTIVE ADHESIVE
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09184839
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Filing Dt:
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11/02/1998
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Title:
|
MINIATURIZED CHIP SCALE BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/02/2003
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Application #:
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09233385
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Filing Dt:
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01/19/1999
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Title:
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DIELECTRIC INTERPOSER FOR CHIP TO SUBSTRATE SOLDERING
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09250524
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Filing Dt:
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02/16/1999
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Title:
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SYSTEMS INTERCONNECTED BY BUMPS OF JOINING MATERIAL
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Patent #:
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Issue Dt:
|
07/31/2001
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Application #:
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09263032
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Filing Dt:
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03/05/1999
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Title:
|
SILICON PACKAGING WITH THROUGH WAFER INTERCONNECTS
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Patent #:
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Issue Dt:
|
01/22/2002
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Application #:
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09496431
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Filing Dt:
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02/02/2000
|
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Title:
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Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board
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Patent #:
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Issue Dt:
|
05/27/2003
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Application #:
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09511478
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Filing Dt:
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02/23/2000
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Title:
|
LEAD-FREE SOLDER POWDER MATERIAL, LEAD-FREE SOLDER PASTE AND A METHOD FOR PREPARING SAME
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Patent #:
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Issue Dt:
|
08/14/2001
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Application #:
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09521354
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Filing Dt:
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03/09/2000
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Title:
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Solder bump forming method and apparatus
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Patent #:
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Issue Dt:
|
12/17/2002
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Application #:
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09527276
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Filing Dt:
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03/17/2000
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Title:
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METHOD AND STRUCTURE OF COLUMN INTERCONNECT
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Patent #:
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Issue Dt:
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01/22/2002
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Application #:
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09536557
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Filing Dt:
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03/28/2000
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Title:
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Method for making interconnect for low temperature chip attachment
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Patent #:
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Issue Dt:
|
05/28/2002
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Application #:
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09536810
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Filing Dt:
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03/28/2000
|
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Title:
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METHOD AND APPARATUS FOR FORMING SOLDER BUMPS
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Patent #:
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Issue Dt:
|
03/04/2003
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Application #:
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09537228
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Filing Dt:
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03/28/2000
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Title:
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METHOD AND APPARATUS FOR FORMING SOLDER BUMPS
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Patent #:
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Issue Dt:
|
04/30/2002
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Application #:
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09559310
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Filing Dt:
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04/27/2000
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Publication #:
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Pub Dt:
|
03/14/2002
| | | | |
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Title:
|
MICRO GRID ARRAY SOLDER INTERCONNECTION STRUCTURE WITH SOLDER COLUMNS FOR SECOND LEVEL PACKAGING JOINING A MODULE AND PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
|
08/06/2002
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Application #:
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09564110
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Filing Dt:
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05/03/2000
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Title:
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HIGH DENSITY COLUMN GRID ARRAY CONNECTIONS AND METHOD THEREOF
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Patent #:
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Issue Dt:
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12/25/2001
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Application #:
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09587944
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Filing Dt:
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06/06/2000
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Title:
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Electrical interconnection package and method thereof
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09644486
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Filing Dt:
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08/23/2000
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Title:
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METHOD FOR ENHANCING FATIGUE LIFE OF BALL GRID ARRAYS
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09660558
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Filing Dt:
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09/12/2000
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Title:
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ELECTRONIC PACKAGE INTERCONNECT STRUCTURE COMPRISING LEAD-FREE SOLDERS
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09697333
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Filing Dt:
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10/26/2000
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Title:
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ELECTROCHEMICAL ETCH FOR HIGH TIN SOLDER BUMPS
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Patent #:
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Issue Dt:
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04/01/2003
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Application #:
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09754782
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Filing Dt:
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01/04/2001
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Publication #:
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Pub Dt:
|
05/10/2001
| | | | |
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Title:
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METHOD OF FORMING BGA INTERCONNECTIONS HAVING MIXED SOLDER PROFILES
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Patent #:
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Issue Dt:
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12/16/2003
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Application #:
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09756062
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Filing Dt:
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01/08/2001
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Publication #:
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Pub Dt:
|
06/28/2001
| | | | |
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Title:
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FLIP CHIP C4 EXTENSION STRUCTURE AND PROCESS
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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09771275
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Filing Dt:
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01/26/2001
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Publication #:
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Pub Dt:
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09/19/2002
| | | | |
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Title:
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LEAD PROTECTIVE COATING COMPOSITION, PROCESS AND STRUCTURE THEREOF
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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09779812
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Filing Dt:
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02/08/2001
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Publication #:
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Pub Dt:
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10/17/2002
| | | | |
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Title:
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LEAD-FREE SOLDER STRUCTURE AND METHOD FOR HIGH FATIGUE LIFE
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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09782471
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Filing Dt:
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02/12/2001
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Publication #:
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Pub Dt:
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08/30/2001
| | | | |
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Title:
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FLIP CHIP C4 EXTENSION STRUCTURE AND PROCESS
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09785787
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Filing Dt:
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02/16/2001
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Publication #:
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Pub Dt:
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06/28/2001
| | | | |
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Title:
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INTERCONNECTION PROCESS FOR MODULE ASSEMBLY AND REWORK
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Patent #:
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Issue Dt:
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04/15/2003
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Application #:
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09825512
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Filing Dt:
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04/03/2001
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Publication #:
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Pub Dt:
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09/06/2001
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Title:
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METHOD OF INTERCONNECTING ELECTRONIC COMPONENTS USING A PLURALITY OF CONDUCTIVE STUDS
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09832073
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Filing Dt:
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04/10/2001
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Publication #:
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Pub Dt:
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08/02/2001
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Title:
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SOLDER BUMP FORMING METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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09838725
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Filing Dt:
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04/19/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Title:
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SYSTEM ON A PACKAGE FABRICATED ON A SEMICONDUCTOR OR DIELECTRIC WAFER WITH WIRING ON ONE FACE, VIAS EXTENDING THROUGH THE WAFER, AND EXTERNAL CONNECTIONS ON THE OPPOSING FACE
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Patent #:
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Issue Dt:
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04/13/2004
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09912192
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07/24/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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REWORK METHODS FOR LEAD BGA/CGA
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Patent #:
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05/11/2004
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10052591
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01/18/2002
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Publication #:
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Pub Dt:
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07/24/2003
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Title:
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HIGH DENSITY RAISED STUD MICROJOINING SYSTEM AND METHODS OF FABRICATING THE SAME
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12/09/2003
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10052620
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01/18/2002
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Publication #:
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Pub Dt:
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07/24/2003
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Title:
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HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD
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07/22/2003
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10151075
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05/17/2002
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Title:
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METHOD OF FORMING A LEAD-FREE TIN-SILVER-COPPER BASED SOLDER ALLOY ON AN ELECTRONIC SUBSTRATE.
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12/23/2003
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10162830
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06/04/2002
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12/12/2002
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Title:
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BALL GRID ARRAY MODULE AND METHOD OF MANUFACTURING SAME
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06/24/2003
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10197291
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07/16/2002
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12/19/2002
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Title:
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ELECTRONIC PACKAGE INTERCONNECT STRUCTURE COMPRISING LEAD-FREE SOLDERS
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04/04/2006
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10205118
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07/25/2002
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12/12/2002
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BUMP CONNECTION AND METHOD AND APPARATUS FOR FORMING SAID CONNECTION
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11/18/2003
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10215451
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08/09/2002
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NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
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08/07/2007
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10346277
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01/16/2003
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07/22/2004
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BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PADS
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06/20/2006
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10357950
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02/04/2003
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07/31/2003
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ENHANCED DESIGN AND PROCESS FOR A CONDUCTIVE ADHESIVE
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02/06/2007
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10400776
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03/27/2003
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09/11/2003
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LEAD-FREE SOLDER POWDER MATERIAL, LEAD-FREE SOLDER PASTE AND A METHOD FOR PREPARING SAME
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11/27/2007
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10680622
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10/07/2003
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04/07/2005
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Title:
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BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
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11/16/2004
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10692065
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10/23/2003
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05/06/2004
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HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD
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02/19/2008
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10711076
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08/20/2004
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02/23/2006
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COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
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01/30/2007
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10711185
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08/31/2004
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03/02/2006
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LOW STRESS CONDUCTIVE POLYMER BUMP
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10/18/2005
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10715649
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11/18/2003
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05/20/2004
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FLIP CHIP C4 EXTENSION STRUCTURE AND PROCESS
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09/25/2007
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10724938
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12/01/2003
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06/02/2005
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BALL LIMITING METALLURGY, INTERCONNECTION STRUCTURE INCLUDING THE SAME, AND METHOD OF FORMING AN INTERCONNECTION STRUCTURE
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08/12/2008
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10815103
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03/31/2004
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10/13/2005
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INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
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12/04/2007
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11204699
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08/16/2005
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02/09/2006
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MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS
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10/28/2008
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11538823
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10/05/2006
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04/19/2007
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LOW STRESS CONDUCTIVE POLYMER BUMP
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03/25/2008
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11625449
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01/22/2007
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11/18/2008
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11838946
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08/15/2007
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11/29/2007
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Title:
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BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
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