Patent Assignment Details
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| Reel/Frame: | 028974/0450 | |
| Pages: | 9 |
| | Recorded: | 09/14/2012 | | |
| Attorney Dkt #: | 213/473 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13407295
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Filing Dt:
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02/28/2012
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Publication #:
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Pub Dt:
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01/03/2013
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Title:
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Wafer Level Package and a Method of Forming the Same
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Assignee
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| 1 FUSIONOPOLIS WAY #20-10 |
| CONNEXIS, SINGAPORE 138632 |
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Correspondence name and address
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CROCKETT & CROCKETT, P.C.
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26020 ACERO
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SUITE 200
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MISSION VIEJO, CA 92691
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