Patent Assignment Details
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| Reel/Frame: | 029045/0385 | |
| Pages: | 2 |
| | Recorded: | 09/28/2012 | | |
| Attorney Dkt #: | 2002-0566A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/05/2004
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Application #:
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10140882
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Filing Dt:
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05/09/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Title:
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COPPER PLATING BATH AND PLATING METHOD FOR SUBSTRATE USING THE COPPER PLATING BATH
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Assignee
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| TIXTOWER UENO 16TH FLOOR, 8-1, HIGASHIUENO 4-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0015 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET, N.W.
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SUITE 400 EAST
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WASHINGTON, DC 20005
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