Patent Assignment Details
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| Reel/Frame: | 029067/0311 | |
| Pages: | 2 |
| | Recorded: | 09/27/2012 | | |
| Attorney Dkt #: | 0271.1005 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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13637441
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Filing Dt:
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09/26/2012
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Publication #:
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Pub Dt:
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01/31/2013
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Title:
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HEAT-DISSIPATING RESIN COMPOSITION USED FOR LED LIGHT HOUSING AND HEAT-DISSIPATING HOUSING FOR LED LIGHTING
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Assignee
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU, TOKYO, 1038338, JAPAN |
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Correspondence name and address
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STEIN MCEWEN, LLP
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ATTENTION: MICHAEL D. STEIN
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1400 EYE ST., N.W., SUITE 300
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WASHINGTON, D.C. 20005
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