Patent Assignment Details
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Reel/Frame: | 029101/0681 | |
| Pages: | 3 |
| | Recorded: | 10/10/2012 | | |
Attorney Dkt #: | 01015.0690U1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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13647474
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Filing Dt:
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10/09/2012
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Publication #:
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Pub Dt:
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04/10/2014
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Title:
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TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (EWLB) PACKAGE, ASSEMBLY AND METHOD
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Assignee
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1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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DAN SANTOS
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TWO RAVINIA DRIVE
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SUITE 700
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ATLANTA, GA 30346
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