Patent Assignment Details
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| Reel/Frame: | 029304/0189 | |
| Pages: | 4 |
| | Recorded: | 11/15/2012 | | |
| Attorney Dkt #: | 17155/030001 (VAV) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13640540
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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03/07/2013
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Title:
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CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM
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Assignee
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| GATE CITY OSAKI, EAST TOWER 8F. |
| 1-11-2, OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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Correspondence name and address
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T. CHYAU LIANG
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909 FANNIN
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SUITE 3500
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HOUSTON, TX 77010
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