Patent Assignment Details
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Reel/Frame: | 029307/0691 | |
| Pages: | 48 |
| | Recorded: | 11/15/2012 | | |
Attorney Dkt #: | CU-7215 RJS/DS |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12347020
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Filing Dt:
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12/31/2008
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Publication #:
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Pub Dt:
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07/23/2009
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME
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Assignee
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2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
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CHICAGO, IL 60604
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