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Reel/Frame:029354/0167   Pages: 3
Recorded: 11/27/2012
Attorney Dkt #:2012_1285A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/03/2017
Application #:
13637216
Filing Dt:
11/27/2012
Publication #:
Pub Dt:
03/14/2013
Title:
THERMALLY EXPANDABLE MICROCAPSULE, METHOD FOR PRODUCING THERMALLY EXPANDABLE MICROCAPSULE, FOAMABLE MASTERBATCH, AND FOAM MOLDED ARTICLE
Assignors
1
Exec Dt:
11/21/2012
2
Exec Dt:
11/21/2012
3
Exec Dt:
11/21/2012
Assignee
1
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI,
OSAKA, JAPAN 530-8565
Correspondence name and address
WENDEROTH, LIND & PONACK, LLP
1030 15TH STREET, N.W.
SUITE 400 EAST
OSAKA, 530-8565 JAPAN

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