Patent Assignment Details
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| Reel/Frame: | 029408/0311 | |
| Pages: | 48 |
| | Recorded: | 12/05/2012 | | |
| Attorney Dkt #: | CU-6047 RJS/DS |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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11869052
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Filing Dt:
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10/09/2007
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Publication #:
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Pub Dt:
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01/01/2009
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Title:
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LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCELLENT ELECTRICAL CONNECTIONS AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
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CHICAGO, IL 60604
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