|
Total properties:
20
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2013
|
Application #:
|
11848403
|
Filing Dt:
|
08/31/2007
|
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
|
Title:
|
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2012
|
Application #:
|
12146792
|
Filing Dt:
|
06/26/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
|
Title:
|
SEMICONDUCTOR MOUNTING BONDING WIRE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2013
|
Application #:
|
12281430
|
Filing Dt:
|
12/02/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/10/2009
| | | | |
|
Title:
|
LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2013
|
Application #:
|
12294416
|
Filing Dt:
|
09/24/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
|
Title:
|
GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2013
|
Application #:
|
12345942
|
Filing Dt:
|
12/30/2008
|
|
Publication #:
|
|
Pub Dt:
|
08/06/2009
| | | | |
|
Title:
|
SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2012
|
Application #:
|
12445789
|
Filing Dt:
|
06/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2010
| | | | |
|
Title:
|
WIRE BONDING STRUCTURE AND METHOD FOR FORMING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2013
|
Application #:
|
12669612
|
Filing Dt:
|
08/05/2010
|
|
Publication #:
|
|
Pub Dt:
|
01/20/2011
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2012
|
Application #:
|
12669662
|
Filing Dt:
|
06/25/2010
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2010
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/24/2012
|
Application #:
|
12670253
|
Filing Dt:
|
07/27/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2011
|
Application #:
|
12747434
|
Filing Dt:
|
06/10/2010
|
|
Publication #:
|
|
Pub Dt:
|
11/11/2010
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2016
|
Application #:
|
12866797
|
Filing Dt:
|
10/21/2010
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2011
| | | | |
|
Title:
|
BONDING STRUCTURE OF BONDING WIRE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2011
|
Application #:
|
12892122
|
Filing Dt:
|
09/28/2010
|
|
Publication #:
|
|
Pub Dt:
|
01/20/2011
| | | | |
|
Title:
|
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2014
|
Application #:
|
12993401
|
Filing Dt:
|
02/01/2011
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2011
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13140770
|
Filing Dt:
|
09/02/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/22/2011
| | | | |
|
Title:
|
SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13264625
|
Filing Dt:
|
10/14/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/16/2012
| | | | |
|
Title:
|
LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/2015
|
Application #:
|
13349155
|
Filing Dt:
|
01/12/2012
|
|
Publication #:
|
|
Pub Dt:
|
05/03/2012
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
13380123
|
Filing Dt:
|
12/22/2011
|
|
Publication #:
|
|
Pub Dt:
|
04/19/2012
| | | | |
|
Title:
|
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
13384819
|
Filing Dt:
|
01/19/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/21/2013
| | | | |
|
Title:
|
BONDING WIRE FOR SEMICONDUCTOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2015
|
Application #:
|
13508864
|
Filing Dt:
|
05/09/2012
|
|
Publication #:
|
|
Pub Dt:
|
09/06/2012
| | | | |
|
Title:
|
SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2014
|
Application #:
|
13577199
|
Filing Dt:
|
08/03/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2012
| | | | |
|
Title:
|
COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICE AND BONDING STRUCTURE THEREOF
|
|
