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Patent Assignment Details

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Reel/Frame:	029458/0905			Pages:	10
		Recorded:	12/06/2012
Attorney Dkt #:	TIPI 5.2-036
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	8704379	Issue Dt:	04/22/2014	Application #:	12199080	Filing Dt:	08/27/2008
Publication #:	US20090065916	Pub Dt:	03/12/2009
Title:	SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

Patent #:	7843046	Issue Dt:	11/30/2010	Application #:	12199667	Filing Dt:	08/27/2008
Publication #:	US20090206458	Pub Dt:	08/20/2009
Title:	FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES

Patent #:	7863159	Issue Dt:	01/04/2011	Application #:	12323288	Filing Dt:	11/25/2008
Publication #:	US20090315174	Pub Dt:	12/24/2009
Title:	SEMICONDUCTOR DIE SEPARATION METHOD

Patent #:	8178978	Issue Dt:	05/15/2012	Application #:	12403175	Filing Dt:	03/12/2009
Publication #:	US20090230528	Pub Dt:	09/17/2009
Title:	SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

Patent #:	8680687	Issue Dt:	03/25/2014	Application #:	12821454	Filing Dt:	06/23/2010
Publication #:	US20100327461	Pub Dt:	12/30/2010
Title:	ELECTRICAL INTERCONNECT FOR DIE STACKED IN ZIG-ZAG CONFIGURATION

Patent #:	8159053	Issue Dt:	04/17/2012	Application #:	12892739	Filing Dt:	09/28/2010
Publication #:	US20110012246	Pub Dt:	01/20/2011
Title:	FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES

Patent #:	9147583	Issue Dt:	09/29/2015	Application #:	12913529	Filing Dt:	10/27/2010
Publication #:	US20110266684	Pub Dt:	11/03/2011
Title:	Selective Die Electrical Insulation By Additive Process

Patent #:	8912661	Issue Dt:	12/16/2014	Application #:	12939524	Filing Dt:	11/04/2010
Publication #:	US20110272825	Pub Dt:	11/10/2011
Title:	STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS

Patent #:	8884403	Issue Dt:	11/11/2014	Application #:	12982376	Filing Dt:	12/30/2010
Publication #:	US20110101505	Pub Dt:	05/05/2011
Title:	Semiconductor Die Array Structure

Patent #:	9153517	Issue Dt:	10/06/2015	Application #:	13109996	Filing Dt:	05/17/2011
Publication #:	US20120119385	Pub Dt:	05/17/2012
Title:	ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED DIE ASSEMBLIES

Patent #:	8829677	Issue Dt:	09/09/2014	Application #:	13243877	Filing Dt:	09/23/2011
Publication #:	US20120248607	Pub Dt:	10/04/2012
Title:	SEMICONDUCTOR DIE HAVING FINE PITCH ELECTRICAL INTERCONNECTS

Patent #:	9305862	Issue Dt:	04/05/2016	Application #:	13456126	Filing Dt:	04/25/2012
Publication #:	US20130099392	Pub Dt:	04/25/2013
Title:	SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

Assignor

Exec Dt:

11/09/2012

Assignee

2702 ORCHARD PARKWAY

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	DARYL K. NEFF
	LERNER, DAVID, LITTENBERG, KRUMHOLZ ET AL
	600 SOUTH AVENUE WEST
	WESTFIELD, NJ 07090

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